Intel has released a new video showing off its advanced packaging technologies. The goal of the video seems to be to attract customers to its Intel Foundry Services (IFS) business by letting the world ...

Avid readers of Tom’s Hardware have read a lot about the upcoming HBM4 and GDDR6 memory technologies, but as neither is used on mass production devices, few of us get to see actual HBM4 and GDDR6 ...

Intel’s upcoming Meteor Lake processors will be the company’s first chips manufactured using a new Intel 4 process, which the company says will bring improvements in performance and efficiency.

Dell’s 16-inch laptop configuration doubles down on memory with 16GB of DDR5 RAM running at 5200 MT/s, giving you more ...

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An advanced packaging technology has been developed that allows the mechanical stacking of chip-scale memory devices using a fine-pitch ball grid array (FBGA) interface. Significantly reducing ...

In the world of solid-state memory fabs, bits per mm 2 rule. In the memory packaging market, mm 2 of silicon per a given package thickness is the defining feature. Both the memory architecture of the ...

Micron Technology, Inc. has announced the shipment of qualification samples for the world’s first 1γ node-based low-power double data rate 5X (LPDDR5X) memory, aimed at enhancing AI applications in ...

Samsung is already talking about being in the early development of totally next-gen DDR6 memory, where during a recent seminar in Suwon, South Korea. During the seminar, Younggwan Ko, Samsung's Vice ...

When we're talking about a memory interface, there are a bunch of salient specifications, but the two most important are generally its width and its transfer rate. Usually, when we hear about new ...